Gùtài yìngpán (Solid State Disk huò Solid State Drive,SSD), yòu chēng gùtài qūdòngqì, shì yòng gùtài diànzǐ cúnchú xīnpiàn zhènliè zhì chéng de yìngpán.SSD kěyǐ lǐjiě wèi róngliàng chāodà de gāosù nèizhì U pán, yóuyú qí méiyǒu jīxiè yìngpán suǒ xū de qūdòng děng jīxiè zhuāngzhì, zhěnggè pán tǐnèi méiyǒu xūyào yídòng de bùjiàn, yīn’ér dé míng gùtài pán. [11]SSD nèibù tōngcháng bāokuò kòngzhì qì, huǎncún hé shǎncún kēlì sān bùfèn, shǎncún kēlì tōngcháng huì yǒu duō gè. [10] Qí cúnchú jiè zhí fēn wéi liǎng zhǒng, yī zhǒng shì cǎiyòng shǎncún (FLASH xīnpiàn) zuòwéi cúnchú jièzhì, lìngwài yī zhǒng shì cǎiyòng DRAM zuòwéi cúnchú jièzhì. Zuìxīn hái yǒu yīngtè’ěr de XPoint kēlì jìshù. [11] Xīn yīdài gùtài yìngpán pǔbiàn cǎiyòng SATA,PCIe,M.2 Děng duō zhǒng wùlǐ jiēkǒu, bìng zhīchí NVMe děng xiéyì. [1] SSD de yōudiǎn shì qǐdòng kuài, dòu qǔ yánchí xiǎo, suìpiàn bù yǐngxiǎng dòu qǔ shíjiān, xiě rù sùdù kuài, wú zàoshēng, fā rèliàng jiào xiǎo, bù huì fāshēng jīxiè gùzhàng, gōngzuò wēndù fànwéi gèng dà, tǐjī xiǎo, zhìliàng xiǎo, néng hào jiào dī; quēdiǎn shì chéngběn gāo, jiàgé ángguì, shòumìng yǒuxiàn, shùjù nányǐ huīfù. [12] Gùtài yìngpán de Trim chóng zhì zhǐlìng kěyǐ bǎ xìngnéng wánquán huīfù dào chūchǎng zhuàngtài. [6] Qí yìngyòng yú jūnshì, chēzài, shìpín jiānkòng, wǎngluò jiānkòng, wǎngluò zhōngduān, diànlì, yīliáo, hángkōng, dǎoháng shèbèi děng lǐngyù. [12]2026 Nián, suízhe AI jìshù jiāsù shāngyè huà yìngyòng, gùtài yìngpán de yìngyòng chǎng yǐng cóng xiāofèi jí xiàng chē guī jí jí qǐyè jí tàzhǎn. [14] Tóngnián, bùfèn dàxíng yóuxì yǐ yāoqiú bìxū shǐyòng gùtài yìngpán zuòwéi cúnchú shèbèi. [15]
展开
565
Solid State Disk (SSD), also known as Solid State Drive, is a hard drive made of solid-state electronic storage chip array. SSD can be understood as a high-speed built-in USB flash drive with a large capacity. Since it does not have the mechanical devices such as drive required by mechanical hard drives, there are no moving parts in the entire disk, hence the name solid-state disk. [11] SSD usually consists of three parts: controller, cache and flash memory chips. There are usually multiple flash memory chips. [10] Its storage media is divided into two types: one uses flash memory (FLASH chip) as the storage medium, and the other uses DRAM as the storage medium. The latest is Intel’s XPoint chip technology. [11] The new generation of solid-state drives generally adopts multiple physical interfaces such as SATA, PCIe, and M.2, and supports protocols such as NVMe. [1] The advantages of SSD are fast startup, low read latency, fragmentation does not affect read time, fast write speed, no noise, low heat generation, no mechanical failure, wider operating temperature range, small size, small weight, and low power consumption; the disadvantages are high cost, high price, limited lifespan, and difficulty in data recovery. [12] The Trim reset command of a solid-state drive (SSD) can completely restore its performance to its factory state. [6] It is used in military, automotive, video surveillance, network monitoring, network terminals, power, medical, aviation, and navigation equipment. [12] In 2026, with the accelerated commercial application of AI technology, the application scenarios of SSDs will expand from consumer-grade to automotive-grade and enterprise-grade. [14] In the same year, some large-scale games have required the use of SSDs as storage devices. [15]
2021 Nián 11 yuè 15 rì, míngxuān fābù qíxià shǒu kuǎn diàn jìng zhī xīn xìliè SSD, guóchǎn zhǔ kòng + guóchǎn TLC kēlì. [7] 2025 Nián 12 yuè 26 rì, huáwèi gōngsī qǐdòng dì liù jiè ào lín pà sī jiǎng quánqiú zhēngjí, xuánshǎng zǒng’é 300 wàn yuán rénmínbì, zhǐ zài jiějué AI shídài de shùjù cúnchú nántí. Běn jiè jiǎngxiàng zhòngdiǎn guānzhù miànxiàng AI shídài de chuàngxīn jièzhì jìshù, qízhōng míngquè jiāng “jīyú SSD de cún suàn rónghé yǔ gāoxiào suǒyǐn jìshù” liè wèi héxīn gōngguān nántí zhī yī. [13] 2026 Nián 1 yuè 2 rì, shēnzhèn hóng xīn yǔ diànzǐ gǔfèn yǒuxiàn gōngsī xiàng gǎng jiāo suǒ zhǔbǎn dìjiāo shàngshì shēnqǐng, qí gùtài yìngpán chǎnpǐn xiàn zhīchí SATA 3.0,PCIe 3.0 Jí PCIe 4.0 Děng duō dài jiēkǒu guīgé, yìngyòng chǎngjǐng yóu xiāofèi jí tàzhǎn zhì chē guī jí yǔ qǐyè jí, kě yìngyòng yú gèrén diànnǎo, shùjù zhōngxīn jí chēzài zhōng kòng xìtǒng děng lǐngyù. [14] 2026 Nián 1 yuè 15 rì, wǎngyì yóuxì “wúxiàn dà”(Project Mugen) xuānbù qí shǒucì fēngbì cèshì de yìngjiàn pèizhì yāoqiú, guīdìng yóuxì kèhù duān bìxū ānzhuāng zài gùtài yìngpán (SSD) shàng, ruò jiǎncè dào shǐyòng jīxiè yìngpán (HDD), qǐdòng qì jiāng jìnzhǐ yóuxì qǐdòng. [15] 2026 Nián 3 yuè 20 rì, cúnchú chǎngshāng kǎi xiá xuānbù yīn jībǎn shēngmìng zhōuqí jiéshù jí shìchǎng xūqiú biànhuà, jiāng tíngzhǐ shēngchǎn TSOP fēngzhuāng de SLC hé MLC shǎncún chǎnpǐn, shèjí róngliàng cóng 1Gb zhì 64Gb, tíngchǎn jìhuà zuìhòu dìngdān jiézhǐ rìqí wèi 2026 nián 9 yuè 15 rì, zuìhòu fā huò jiézhǐ rìqí wèi 2027 nián 3 yuè 15 rì. [16] 2026 Nián 3 yuè 26 rì, shí quán kējì (Team Group) zài qí nèiróng chuàngzuò chǎnpǐn xiàn T-CREATE zhōng tuīchū xīnkuǎn M.2 NVMe gùtài yìngpán CLASSIC H514. Gāi xínghào cǎiyòng 6nm zhìchéng zhǔ kòng yǔ 3D NAND shǎncún, shùnxù dú xiě sùlǜ dá 14.2GB/s yǔ 13.3GB/s, dú xiě yánchí wèi 0.05Ms yǔ 0.015Ms, bìng tígōng shímò xī yǔ lǚ héjīn liǎng zhǒng sànrè piàn fāng’àn. [17] 2026 Nián 3 yuè, lán sī kējì zǔzhuāng de qǐyè jí SSD gùtài yìngpán zài xiāngtán gōngchǎng pīliàng chū huò, kāishǐ guīmó bùshǔ yú tóu bù hùliánwǎng dà chǎng, diànxìn yùnyíng shāng hé yínháng xìtǒng, bìng néng tígōng dìngzhì huà jiějué fāng’àn. [21] 2026 Nián 3 yuè, lán sī kējì jiākuài tuījìn zìzhǔ kāifā de HDD bōlí jībǎn kèhù yànzhèng, dài yànzhèng tōngguò, tā jiāng quánmiàn fùgài SSD zǔzhuāng yǔ HDD héxīn bùjiàn gōngyìng. [21] 2026 Nián 4 yuè 20 rì, cúnchú chǎngshāng jiāngbō lóng zài tóuzī zhě wèndá zhōng tòulù, gōngsī yǐ yǔ chángjiāng cúnchú, zhǎng xīn cúnchú děng quánqiú zhǔyào jīng yuán yuán chǎng dáchéng shēn céngcì hézuò.2025 Nián shàng bànnián qí zài zhōngguó qǐyè jí SATA SSD shìchǎng zǒng róngliàng páimíng wèi liè dì sān, guóchǎnpǐnpái jū shǒu. Tóngshí, qí chē guī jí cúnchú chǎnpǐn yǐ jìnrù běiměi zhìnéng qìchē jí zìdòng jiàshǐ kējì jùtóu de gōngyìng liàn tǐxì. [18] 2026 Nián 05 yuè 06 rì, hǎidào shēngcún yóuxì “Windrose: Fēng qǐ zhī lǚ” zài qiǎngxiān tǐyàn chūqí, yīn zài tèdìng chǎngjǐng xià chǎnshēng yìcháng gāo de yìngpán I/O fùzǎi (xiě rù liàng fēngzhí kě dá měi xiǎoshí 108GB) ér yǐnfā wánjiā duì gùtài yìngpán (SSD) sǔnhào de dānyōu. Suíhòu, yóuxì kāifā shāng Kraken Express fābùle xiūfù bǔdīng, jiějuéle gāi wèntí bìng yōuhuàle cún dǎng xìtǒng. Gāi yóuxì shàngxiàn liù tiān xiāoliàng jí túpò 100 wàn fèn. [19] 2026 Nián 5 yuè 21 rì, jù zhèngquàn shíbào bàodào, guóchǎn cúnchú lóngtóu chángjiāng cúnchú wánchéng IPO fǔdǎo bèi’àn, zhǎng xīn kējì kē chuàng bǎn IPO dìng yú 5 yuè 27 rì shàng huì, liǎng jiā qì yè shàngshì jìnchéng tísù.AI chǎnyè kuàisù juéqǐ, qūdòng HBM,DDR5, qǐyè jí SSD děng gāoduān cúnchú chǎn pǐn xūqiú dàfú zēngzhǎng, cúnchú hángyèjìnrù xīn de fǎ zhǎn jiēduàn. Zài AI xūqiú qūdòng xià, dé mínglì, jiāngbō lóng, bǎi wéi cúnchú děng zhōngduān cúnchú qǐyè 2026 nián dì yī jìdù yè jì jūn shíxiàn niǔkuī wéi yíng. Chángjiāng cúnchú yú 2025 nián 9 yuè qǐdòng sān qī wǔhàn jīdì jiànshè,2026 niánchū yǐ jìnrù shèbèi ānzhuāng jiēduàn; zhǎng xīn kējì jìhuà zài 2026 niándǐ qǐdòng HBM chǎn xiàn jiànshè, yǐ bǔ qí guóchǎn suàn lì gōngyìng liàn guānjiàn duǎn bǎn. [20]
1,411
On November 15, 2021, Maxsun released its first gaming-focused SSD, featuring a domestic controller and domestic TLC NAND flash memory. [7] On December 26, 2025, Huawei launched the sixth Olympus Awards global call for entries, offering a total reward of RMB 3 million, aiming to solve the data storage problem in the AI era. This year’s awards focus on innovative media technologies for the AI era, with “SSD-based storage-computing fusion and efficient indexing technology” listed as one of the core challenges. [13] On January 2, 2026, Shenzhen Hongxinyu Electronic Co., Ltd. submitted a listing application to the main board of the Hong Kong Stock Exchange. Its solid-state drive product line supports multiple generations of interface specifications such as SATA 3.0, PCIe 3.0 and PCIe 4.0, and its application scenarios have expanded from consumer-grade to automotive-grade and enterprise-grade, and can be applied to personal computers, data centers and vehicle central control systems. [14] On January 15, 2026, NetEase Games’ Project Mugen announced the hardware configuration requirements for its first closed beta test, stipulating that the game client must be installed on a solid-state drive (SSD). If a mechanical hard drive (HDD) is detected, the launcher will prevent the game from starting. [15] On March 20, 2026, storage manufacturer Kioxia announced that due to the end of the substrate life cycle and changes in market demand, it will stop producing TSOP packaged SLC and MLC flash memory products, involving capacities from 1Gb to 64Gb. The last order deadline for the production stoppage plan is September 15, 2026, and the last shipment deadline is March 15, 2027. [16] On March 26, 2026, Team Group launched a new M.2 NVMe solid-state drive, the CLASSIC H514, in its content creation product line T-CREATE. The model uses a 6nm process controller and 3D NAND flash memory, with sequential read and write speeds of 14.2GB/s and 13.3GB/s, and read and write latencies of 0.05ms and 0.015ms, respectively. It also provides two heat sink solutions: graphene and aluminum alloy. [17] In March 2026, Lens Technology’s enterprise-grade SSD solid-state drives were shipped in batches from its Xiangtan factory, and began large-scale deployment in leading Internet companies, telecom operators and banking systems, and can provide customized solutions. [21] In March 2026, Lens Technology accelerated the customer verification of its self-developed HDD glass substrate. Once the verification is passed, it will fully cover SSD assembly and HDD core component supply. [21] On April 20, 2026, storage manufacturer Jiangbolong revealed in an investor Q&A that the company has reached in-depth cooperation with major global wafer foundries such as Yangtze Memory and Changxin Memory. In the first half of 2025, it ranked third in total capacity in the Chinese enterprise-grade SATA SSD market and first among domestic brands. Meanwhile, its automotive-grade storage products have entered the supply chain system of North American smart car and autonomous driving technology giants. [18] On May 6, 2026, the pirate survival game Windrose: The Journey of the Windsor, in its early access phase, caused players to worry about the wear and tear of solid-state drives (SSDs) due to abnormally high hard disk I/O load (the peak write volume can reach 108GB per hour) in a specific scenario. Subsequently, the game developer Kraken Express released a patch to fix the problem and optimize the save system. The game sold more than 1 million copies in six days after its launch. [19] On May 21, 2026, according to the Securities Times, Yangtze Memory Technologies Co., Ltd., a leading domestic storage company, completed its IPO guidance filing, and Changxin Technology Co., Ltd.’s IPO on the Science and Technology Innovation Board is scheduled to be reviewed on May 27. The listing process of the two companies has accelerated. The rapid rise of the AI industry has driven a significant increase in demand for high-end storage products such as HBM, DDR5, and enterprise-grade SSDs, and the storage industry has entered a new stage of development. Driven by AI demand, terminal storage companies such as Demingli, Jiangbolong, and Biwin Storage all achieved a turnaround in performance in the first quarter of 2026. Yangtze Memory started the construction of the third phase of its Wuhan base in September 2025, and entered the equipment installation stage in early 2026; Changxin Technology plans to start the construction of its HBM production line by the end of 2026 to make up for the key shortcomings in the domestic computing power supply chain. [20]
